在严苛工况下,应用于光伏发电和风电系统逆变器中的IGBT模块极易老化,进而在焊料层中形成空洞,而芯片材料的热物性也会因高温而发生变化,两者结合将大幅影响耦合模型的预测精度。基于此,在热耦合效应下,对焊料层空洞和芯片热效应对芯片结温的影响进行分析,建立同时考虑IGBT芯片焊料层空洞损伤和芯片材料热效应的改进双支耦合Cauer模型。通过有限元方法研究不同空洞率对IGBT模块热特性的影响,并给出含有空洞时焊料层热阻的计算方法。在此基础上,进一步考虑IGBT模块芯片热参数对温度的依赖关系,建立芯片热阻-温度的函数模型。最终,通过实验验证所提改进模型的准确性和有效性,提高了IGBT模块的结温预测精度,增强了光伏发电和风电系统中逆变器的可靠性。
Abstract
Under severe operating conditions, IGBT modules used in inverters for photovoltaic and wind power systems are highly susceptible to aging, which leads to the formation of voids in the solder layer, and the thermo-physical properties of the chip material alsomay change due to high temperatures, and the combination of the two factors will significantly affect the prediction accuracy of the coupling model. Based on this, the influence of solder layer voids and chip thermal effects on chip junction temperature are analyzed under the thermal coupling effect, and an improved double-branch coupling Cauer model that simultaneously considers the damage of solder layer voids and the thermal effects of chip materials in the IGBT chip is established. The effects of different voiding rates on the thermal characteristics of IGBT modules are investigated by the finite element method, and the calculation method of the thermal resistance of the solder layer when containing voids is given. On this basis, the dependence of the thermal parameters of the chip of the IGBT module on the temperature is further considered, and the function model of the chip thermal resistance-temperature is established. Ultimately, the accuracy and validity of the proposed improved model is experimentally verified, which improves the junction temperature prediction accuracy of IGBT modules and enhances the reliability of inverters in photovoltaic and wind power systems.
关键词
逆变器 /
IGBT模块 /
结温 /
热物性 /
焊料层空洞 /
Cauer热网络模型
Key words
inverter /
IGBT module /
junction temperature /
thermophysical properties /
solder layer voids /
Cauer thermal network model
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参考文献
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