光伏单晶硅细线超薄切片加工研究进展

葛梦然; 赵桂丽; 郑金涛; 赵玉康; 邢旭; 葛培琪

doi:10.19912/j.0254-0096.tynxb.2023-1581

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太阳能学报 ›› 2024, Vol. 45 ›› Issue (11) : 183-193. DOI: 10.19912/j.0254-0096.tynxb.2023-1581

光伏单晶硅细线超薄切片加工研究进展

葛梦然¹, 赵桂丽¹, 郑金涛², 赵玉康², 邢旭³, 葛培琪²

作者信息 +

REVIEW ON ULTRATHIN WAFER SLICING OF PHOTOVOLTAIC MONOCRYSTALLINE SILICON WITH THINNER DIAMOND WIRE SAW

Ge Mengran¹, Zhao Guili¹, Zheng Jintao², Zhao Yukang², Xing Xu³, Ge Peiqi²

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文章历史 +

摘要

分析光伏单晶硅切片加工的原理和现状,金刚石线锯母线直径已降低至37 μm,G12半片光伏单晶硅片的切片厚度已减小到110 μm。阐述光伏硅晶体高出片率切片加工的主要技术途径是锯切硅片厚度减薄和金刚石线锯直径减小。分别讨论锯切硅片表面裂纹损伤和断裂强度、金刚石线锯间和硅片间的液桥作用以及机器视觉检测对光伏单晶硅高出片率切片加工的影响。对光伏单晶硅高出片率切片加工面临的关键技术提出展望：1）开发低成本钨丝金刚石线锯;2）研发新型冷却润滑液和冷却润滑技术;3）研发切片加工新工艺;4）建立电镀金刚石线锯表面磨粒分布状态与切片加工性能之间的量化关系。

Abstract

The principle and state-of-art of PV monocrystalline silicon slicing processing are reviewed herein. The core wire diameter of the diamond wire saw has been reduced to 37 μm. The as-cut half G12 wafer thickness of PV monocrystalline silicon has been reduced to 110 μm. It is elaborated that the main technical approaches for high wafer yield slicing are to reduce the as-cut wafer thickness and the diameter of diamond wire saw. The effects of surface crack damage and fracture strength of sliced silicon wafer, liquid bridge interaction at diamond wire saws and as-cut silicon wafers, and machine vision detection on the high wafer yield slicing processing of PV monocrystalline silicon are discussed. The key technologies faced in the high wafer yield slicing processing of PV monocrystalline silicon are proposed： 1） to develop low-cost tungsten core wire diamond wire saw; 2） to develop new coolants and lubricating technologies; 3） to develop new slicing processing technology; 4） to establish a quantitative relationship between the distribution of abrasives and the machining performance of electroplated diamond wire saw.

导出引用

葛梦然, 赵桂丽, 郑金涛, 赵玉康, 邢旭, 葛培琪. 光伏单晶硅细线超薄切片加工研究进展[J]. 太阳能学报. 2024, 45(11): 183-193 https://doi.org/10.19912/j.0254-0096.tynxb.2023-1581

Ge Mengran, Zhao Guili, Zheng Jintao, Zhao Yukang, Xing Xu, Ge Peiqi. REVIEW ON ULTRATHIN WAFER SLICING OF PHOTOVOLTAIC MONOCRYSTALLINE SILICON WITH THINNER DIAMOND WIRE SAW[J]. Acta Energiae Solaris Sinica. 2024, 45(11): 183-193 https://doi.org/10.19912/j.0254-0096.tynxb.2023-1581

中图分类号： TK511

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