REVIEW ON ULTRATHIN WAFER SLICING OF PHOTOVOLTAIC MONOCRYSTALLINE SILICON WITH THINNER DIAMOND WIRE SAW

Ge Mengran; Zhao Guili; Zheng Jintao; Zhao Yukang; Xing Xu; Ge Peiqi

doi:10.19912/j.0254-0096.tynxb.2023-1581

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Acta Energiae Solaris Sinica ›› 2024, Vol. 45 ›› Issue (11) : 183-193. DOI: 10.19912/j.0254-0096.tynxb.2023-1581

REVIEW ON ULTRATHIN WAFER SLICING OF PHOTOVOLTAIC MONOCRYSTALLINE SILICON WITH THINNER DIAMOND WIRE SAW

Ge Mengran¹, Zhao Guili¹, Zheng Jintao², Zhao Yukang², Xing Xu³, Ge Peiqi²

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Abstract

The principle and state-of-art of PV monocrystalline silicon slicing processing are reviewed herein. The core wire diameter of the diamond wire saw has been reduced to 37 μm. The as-cut half G12 wafer thickness of PV monocrystalline silicon has been reduced to 110 μm. It is elaborated that the main technical approaches for high wafer yield slicing are to reduce the as-cut wafer thickness and the diameter of diamond wire saw. The effects of surface crack damage and fracture strength of sliced silicon wafer, liquid bridge interaction at diamond wire saws and as-cut silicon wafers, and machine vision detection on the high wafer yield slicing processing of PV monocrystalline silicon are discussed. The key technologies faced in the high wafer yield slicing processing of PV monocrystalline silicon are proposed： 1） to develop low-cost tungsten core wire diamond wire saw; 2） to develop new coolants and lubricating technologies; 3） to develop new slicing processing technology; 4） to establish a quantitative relationship between the distribution of abrasives and the machining performance of electroplated diamond wire saw.

Key words

photovoltaics / sawing / monocrystalline silicon / diamond wire saw / as-cut wafer thickness / kerf loss

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Ge Mengran, Zhao Guili, Zheng Jintao, Zhao Yukang, Xing Xu, Ge Peiqi. REVIEW ON ULTRATHIN WAFER SLICING OF PHOTOVOLTAIC MONOCRYSTALLINE SILICON WITH THINNER DIAMOND WIRE SAW[J]. Acta Energiae Solaris Sinica. 2024, 45(11): 183-193 https://doi.org/10.19912/j.0254-0096.tynxb.2023-1581

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