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BONDING WIRE AGING MONITORING METHOD BASED ON COMBINATION OF JUNCTION TEMPERATURE IMMUNITY ELECTRICAL PARAMETERS IN IGBT MODULE
Fan Hechang, Du Mingxing
Acta Energiae Solaris Sinica . 2025, (11): 244 -250 .  DOI: 10.19912/j.0254-0096.tynxb.2024-1193

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